_______________________________________________

-  THE FRIDAY LETTER  -

(emailed weekly, from Gilder Publishing,
for friends and subscribers)

_______________________________________________


 | http://www.gilder.com/ | Issue 290.0/April 13, 2007

SIGN-UP A FRIEND FOR FREE!
 

 

HEADLINES:

-  The Week / Power-One: A Raving Buy?
-  Friday Feature / 3-D Chips
-  Friday Blogger Bonus / Rutledge: Asian Energy Security
-  Readings /


SPECIAL OFFER

Exploit the Uranium Conspiracy

 

After hiding its activities from UN inspectors, Iran has now confessed to a major expansion of its uranium enrichment capacity. Experts believe this takes Iran a step closer to building a nuclear weapon.

 

While this is very bad news for the civilized world, it's very good news for the company with a virtual monopoly on a critical uranium enrichment technology. Learn here how you can Profit from this Tiny $5 Stock.

 

The Week / Power-One: A Raving Buy?

Gilder Telecosm Forum member 1:
From Power-One’s (PWER) last earnings report:
- Profitability forecasted for Q107 with net revenue of $125 to $135 million
- Revenue guidance for fiscal 2007 reaffirmed at $530 million to $550 million
- Z-One(R) Digital Power Management patent infringement Markman hearing concludes; design wins increase to approximately 80
- Current market cap... $471 million.

PWER's most recent slides, dated March, 2007:
http://media.corporate-ir.net/media_files/irol/73/73416/presentations/2007_March.ppt


George Gilder:
Does anyone know why this company is not now a raving buy? I am going to expand my holdings unless someone can tell me what is going on that accounts for the slump.

Gilder Telecosm Forum member 2: George, My guess is someone could be speculating that there is an options problem here a la SIGM, though the current (last reported) short position is only about 8% of the float. This is one tech company, which has had nothing to say on the issue thus far (as far as I know). IRF revealed some accounting problems just yesterday and their stock dropped about 8% (I see it is back up a bit today). I've been buying PWER myself as I see limited downside from here and a lot of potential on the upside. The market is giving the stock ZERO credit for Z-One and, it seems, the potential for the company to dominate digital power.

Gilder Telecosm Forum member 1: PWER has 80 Z-One design wins, which encompass 400 slots on various circuit boards. So far, Z-One revenues have been insignificant. I believe this will begin to change by year-end. One over hang lately… the Artesyn lawsuit. This should be resolved in a few months in PWER's favor. PWER could end up with a corner on the market in digital power architecture for circuit boards.

 

Gilder Telecosm Forum member 3: Frankly, I just can’t see anything in the Z-One approach that is earth shattering or anything other than a small-to-medium step in the slow migration toward digital implementations of previously analog functions – a migration which has preceded for about three decades.

Their approach, while okay, doesn’t seem to me to confer profound advantages over what exists now or could exist if someone like Texas Instruments or Analog Devices really thought that chips of this type had some major market potential. TI and Analog Devices and MicroChip and Free Scale all know how to make a voltage regulator and a serial bus, and have been making digital signal processor and microcontroller chips for decades. I’m guessing they didn't put 'em together in a digital power regulator (as did Power One) not because they didn't know how, but because of a perceived limited market.


GTF Analyst Charlie Burger:
The disappointing 4Q, as mentioned in the Stephens report, is just what I was expecting and one reason why I was especially negative after the acquisition. Now it has happened, so we move on. Yes, there may be one more disappointing quarter (or maybe not), but looking ahead this stock can only go up long-term at this absurd price. My biggest concern short-term, if you read my lastest analysis on the company section of the GTR page, is that the lowered net income may require Power to issue more shares or borrow. That would keep the stock down for a while. But even at that, long-term with Z-One, this is still a good buy.

To read more posts by George Gilder and the GTR subscribers log on with your subscriber ID at
http://www.gildertech.com/board/.

SPECIAL OFFER

The Gilder Telecosm Forum

If you are a Gilder Technology Report subscriber and you are not a registered member of the Gilder Telecosm Forum (www.Gildertech.com/board/) you are missing out on a supremely valuable opportunity to gain timely and actionable technology investment information.

The Gilder Telecosm Forum is the Gildertech.com technology investment message board, where hundreds of investors, entrepreneurs, engineers, money managers and technology leaders, including George Gilder and the GTF analysts, gather daily to share investment advice and debate technology,
investing, economics, politics and finance — and membership is FREE to all Gilder Technology Report subscribers!

 

Register today using your GTR password to gain entry into the web’s premier technology investment community.


 
Forum Member: As of now, I AM BACK to my pre-crash "peak" wealth.
    Thank you Sigma (SIGM) and EZchip (LNOP), among others.

 
 
Forum Member: Congratulations! I am 60% there. Had I been diligently
    reading this forum last summer, I would have probably had 50,000-80,000 
    shares of Sigma at $8-something. But I'm not complaining!
 


Log on now to find out what else you’ve been missing:
http://www.gildertech.com/board/


Friday Feature / 3-D Chips

Nick Tredennick, Gilder Technology Report (04/11/07):

Samsung is experimenting with wafer stacking. Since wafer stacking shortens interconnects, Samsung finds that its wafer-stacked 16-Gb flash memory is about 30 percent faster. Samsung expects to ship wafer-stacked chips in NAND–based memory modules early this year. Samsung has said that it will also do system-in-package chips and high-capacity DRAM. Samsung isn’t alone. A partnership among NEC Electronics (NIPNY), Elpida Memory, and Oki Electric has announced stacked flash chips. Micron (MU) is doing wafer-level packaging that uses TSVs. Freescale is working on TSV interconnection. IBM (IBM) is developing 3-D chips with a virtually unlimited number of interconnections between its layers.

 

Tezzaron Semiconductor is a fabless semiconductor company with several wafer-stacked products. It has 3-D stacked SRAM, 3-D stacked DRAM, and 3-D stacked SRAM with an 8051 microcontroller. Tezzaron, which was featured in my article of five years ago (back then it was Tachyon Semiconductor), has been a pioneer in the development of wafer stacking. Bob Patti, Tezzaron’s CTO then and now, knows why wafer stacking has taken a long time to develop. It isn’t because it is particularly difficult technically; it has more to do with specialization of job functions.

 

As John Trezza of the pioneering Cubic Wafer of Austin (formerly Xanoptix) discovered, (see Gilder Technology Report, January 2006) design engineers and manufacturing engineers live in separate worlds. When Tezzaron and Glenn Leedy’s Elm Technology, a holder of fundamental patents in wafer stacking, went to large semiconductor companies to talk about wafer stacking, they typically got shuttled to the manufacturing (process) engineers. Wafer stacking does look like it belongs to the process engineers. But wafer stacking requires participation by the design engineers, who not only weren’t meeting with Tezzaron and Elm, but had no incentive to deviate from techniques that were working perfectly well for them (shrinking transistors). The processor-memory bottleneck, shrinking system sizes, and the search for lower power consumption are finally changing designer incentives. Even when the designers are on board with wafer stacking, there’ll be a delay as the electronic design automation (EDA) software companies revise their products to support the design for stacked wafers.

 

Equipment vendors Alcatel (ALA), EV Group, XSiL, and our favorite Semitool (SMTL) formed the EMC-3D consortium with the goal of lowering the cost of the 3-D process below $200 per wafer. I discussed wafer stacking five years ago (“Life After Moore’s Law,” Dynamic Silicon, Jan 2002). That was early; if the equipment makers are thinking about it, it’s probably about to take off.

 

Because they are flat, today’s chips aren’t efficient. Imagine the area inefficiency if Hong Kong or New York were to abandon skyscrapers. It’s easy enough to do: that’s Los Angeles. Today’s chips are Los Angeles….
___________________

RELATED READING:
IBM Touts Breakthrough in 3-D Chips (WSJ, 04/12/07)

 

IBM Corp. said it achieved a breakthrough in developing a three-dimensional semiconductor chip that can be stacked on top of another electronic device in a vertical configuration long sought by engineers to reduce size and power use.

 

IBM's new method, which uses current semiconductor manufacturing technology, involves creating tiny holes called "through-silicon-vias" that are etched all the way through a chip and then injected with tungsten to create wires. "This allows us to move 3-D chips from the lab," said Lisa Su, vice president, semiconductor research and development center.
http://online.wsj.com/article_email/SB117633745391667111-lMyQjAxMDE3NzE2MjMxMzI3Wj.html


SPECIAL OFFER

Gilder/Forbes Telecosm 2007
 
Pursuing opportunities, celebrating entrepreneurship and seeking upside surprises.

Hosted by George Gilder and Steve Forbes | October 17 – October 18
The Sagamore Resort | Lake George, New York


http://www.TelecosmConference.com/


Friday Blogger Bonus
/ Rutledge: Asian Energy Security

John
Rutledge (04/10/07): I've written a piece on Asian Energy Security for the Chinese Academy of Sciences that will be published later this spring. You can see the abstract below.

ABSTRACT: Strong growth and rising energy needs are increasing Asia’s reliance on energy supplies from the troubled Middle East, making energy security an urgent issue. Existing policies, based on orthodox demand-based economics and an overly narrow concept of energy are unlikely to solve the problem. This paper presents a new framework for thinking about energy and economic growth based on the broad concept of energy used in the natural sciences. This framework views economic activity as transfers of both current solar energy and vintage solar energy, stored in the form of natural resources, human capital, physical capital, and technology, driven by the uncompromising laws of thermodynamics. It points toward unconventional solutions to the energy security problem including investing in communication networks, information technology, and education; agricultural research to increase the efficiency plant energy capture and improve the productivity of farm workers and, thereby, release manpower for the energy-efficient services sector; and legal, regulatory, and exchange rate policies to provide a stable environment to attract high tech capital from global investors.

Check out John’s blog:
http://www.rutledgeblog.com/
____________________________________

Readings /  

The Weekly GTI
http://www.gtindex.com/

George Gilder to Speak at Freedomfest
http://www.freedomfest.com/speakers.htm

 

India cell phone subscribers to triple
http://www.eetimes.com/news/latest/showArticle.jhtml;jsessionid=DPWRS2HTVPFJ4QSNDLSCKHA?articleID=199000381

Fairlight Uses Altera FPGAs in Crystal Core Media Processing Engine
http://www.itnewsonline.com/showstory.php?storyid=9275&scatid=3&contid=3


Sony studies commercial PlayStation 3 supercomputing grid
http://www.eetimes.com/news/latest/showArticle.jhtml?articleID=199000315

Kessler: Sloshing
http://www.andykessler.com/

My Friend,
Milton Friedman
http://www.city-journal.org/html/eon2007-04-11cb.html

__________________________________________

SIGN-UP A FRIEND FOR FREE!
Click here to add a friend to our Friday Letter mailing list.
__________________________________________

FRIDAY LETTER STAFF

Editor: Mary Collins / mcollins@gilder.com

Research: Sandy Fleischmann / sfleischmann@gilder.com

 

ADVERTISING INFORMATION

The Friday Letter is mailed each week to more than 40,000-plus subscribers and friends of Gilder Publishing, including industry leaders, financial professionals and individual investors. For information about advertising, contact Linda Bentley at lbentley@forbes.com.

PLEASE NOTE: The appearance of an advertisement in the Friday Letter does not indicate an endorsement for the product and/or service by George Gilder, Gilder Publishing LLC, or the Friday Letter staff.

 

FEEDBACK AND PROBLEMS

For technical problems, or to send letters to the editor, please e-mail info@gilder.com.

 

MAILING ADDRESS

Gilder Publishing, LLC

ATTN: Friday Letter

291A Main Street

Great Barrington, MA 01230

_______________________________________________

The Friday Letter is published weekly for subscribers and friends of Gilder Publishing. If someone you know would enjoy it, please feel free to forward a copy.

 

Gilder Publishing makes the Friday Letter available for free. To help defray some of the costs of producing this information on a weekly basis, we will from time to time be sending you offers from companies we think you'll be interested in. These offers will not come more than once a week. If you do not wish to receive this related information, please opt out of this process at the link below and we will not share your name with companies outside of Gilder Publishing.

 

To SUBSCRIBE please visit http://www.gilder.com/

To UNSUBSCRIBE please go to http://www.gilder.com/fridayletter/unsubscribe.php

 

Trouble subscribing or unsubscribing?

Email info@gilder.com

 

http://www.gilder.com/unsubscribe/specialproducts.php

 

To SUBSCRIBE please visit http://www.gilder.com/

To UNSUBSCRIBE please go to http://www.gilder.com/fridayletter/unsubscribe.php

 

Trouble subscribing or unsubscribing?

Email info@gilder.com

_______________________________________________

Copyright 2007 Gilder Publishing LLC